Memory wall is a term used to describe the greater need for both memory bandwidth and memory density needed for growing number of processor cores in current microprocessors. Whereas DDR4 represents an evolutionary standard, IBM and Micron Technology announced that they will begin production of Hybrid Memory Cube (HMC) – a memory device built using ... »

IBM partnered with 3M in order to develop adhesives that can be used to package semiconductors into 3D semiconductors. In order to develop these densely stacked silicon “towers”, IBM will draw on their expertise in creating unique semiconductor packaging processes, and 3M will provide their expertise in developing and manufacturing adhesive materials. The joint research ... »

Previous attempts at making 3D photonic crystals have resulted in devices that are only optically active (they can’t turn electricity to light or vice versa). A group of researchers, led by researchers from the University of Illinois, have managed to develop the first optoelectronically active 3D photonic crystal. The development could enable new advancements for ... »

Scientists have great expectations that nanotechnologies will bring them closer to the goal of creating computer systems that can simulate and emulate the brain’s abilities for sensation, perception, action, interaction and cognition while rivaling its low power consumption and compact size. Nanotechnology researchers in France have developed a hybrid nanoparticle-organic transistor that can mimic the ... »

You remember we wrote about carbon nanotubes (CNTs) in one of our previous articles? Two groups of researchers have found ways to unfold CNTs in order to make nanoribbons of graphene. The experts claim that the development could point the way towards a new generation of electronics, including computer chips that are faster and tinier ... »