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IBM and 3M developing new types of adhesives to create 3D semiconductors

By Damir Beciri
10 September 2011

ibm-stacked-chipsIBM partnered with 3M in order to develop adhesives that can be used to package semiconductors into 3D semiconductors. In order to develop these densely stacked silicon “towers”, IBM will draw on their expertise in creating unique semiconductor packaging processes, and 3M will provide their expertise in developing and manufacturing adhesive materials. The joint research… »