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IBM silicon nanophotonics tech ready for commercialization

By Damir Beciri
3 Comments16 December 2012

ibm-silicon-nanophotonics-1The amount of data being created and transmitted over enterprise networks continues to grow due to an explosion of new applications and services. IBM recently revealed a major breakthrough in the ability to use light instead of electrical signals to transmit information for future computing. Called silicon nanophotonics, the technology allows the integration of different… »


Augmented reality makes shopping more personal

By Damir Beciri
3 July 2012

ibm-ar-shopping-advisor-appShopping for groceries in supermarkets can sometimes be very exhausting, especially if they pile up similarly looking goods near each other. On the other hand, if you are exploring new products, you might have ended looking at the whole isle of products you haven’t tried before, and you don’t know does their composition suit your… »


Battery 500 Project – IBM’s lithium-air battery development

By Damir Beciri
3 Comments22 April 2012

ibm-battery-500IBM Research started the Battery 500 Project to develop lithium-air battery technology that could be used to power a family-sized electric car for approximately 500 miles (800 km) on a single charge back in 2009. The project has recently got additional support from Asahi Kasei and Central Glass – two companies with decades of experience… »


Micron’s Hybrid Memory Cube to be produced by IBM

By Damir Beciri
2 Comments6 December 2011

3d-hmcMemory wall is a term used to describe the greater need for both memory bandwidth and memory density needed for growing number of processor cores in current microprocessors. Whereas DDR4 represents an evolutionary standard, IBM and Micron Technology announced that they will begin production of Hybrid Memory Cube (HMC) – a memory device built using… »


IBM and 3M developing new types of adhesives to create 3D semiconductors

By Damir Beciri
10 September 2011

ibm-stacked-chipsIBM partnered with 3M in order to develop adhesives that can be used to package semiconductors into 3D semiconductors. In order to develop these densely stacked silicon “towers”, IBM will draw on their expertise in creating unique semiconductor packaging processes, and 3M will provide their expertise in developing and manufacturing adhesive materials. The joint research… »